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中芯国际申请一种半导体结构等相关专利, 提升半导体结构的器件性能和可靠性
Sou Hu Cai Jing·2025-08-25 00:59

Group 1 - The core viewpoint of the news is that three subsidiaries of SMIC have applied for a patent related to semiconductor structures, which aims to improve device performance and reliability through innovative design [1][2][3] Group 2 - SMIC International Integrated Circuit Manufacturing (Tianjin) Co., Ltd. was established in 2003, has a registered capital of 1.29 billion, and has participated in 104 bidding projects with 387 patent records [1] - SMIC North Integrated Circuit Manufacturing (Beijing) Co., Ltd. was established in 2013, has a registered capital of 480 million, and has participated in 51 bidding projects with 137 patent records [2] - SMIC International Integrated Circuit Manufacturing (Shanghai) Co., Ltd. was established in 2000, has a registered capital of 244 million, has invested in 4 companies, participated in 127 bidding projects, and holds 5000 patent records [2]