Sou Hu Cai Jing·2025-08-26 00:06Group 1: Zhaoyi Innovation - Zhaoyi Innovation reported strong growth across various business lines in Q2 2024, with NOR Flash experiencing high single-digit growth, niche DRAM growing over 50%, MCU close to 20%, and sensor chips growing approximately 10% [1] - The company anticipates a quarter-on-quarter growth in Q3, with overall demand expected to rise throughout the year, particularly for niche DRAM, which is facing supply tightness [1] - The overall gross margin is expected to remain stable, with a slight increase in DRAM gross margin and moderate price increases for Flash products [1] - The demand for NOR Flash is driven by an increase in electronic product code volume, while supply constraints are expected to persist due to tight wafer manufacturing capacity [1] - The company is optimistic about customized storage technology, which offers performance advantages, and anticipates more industries and clients will adopt this solution [1] - MCU growth is projected in industrial control, energy storage, and high-end domestic replacement sectors, with new product revenue contributions expected to rise [1] - DDR4 8Gb revenue is expected to contribute one-third of DRAM revenue for the year, while LPDDR4 small-capacity products may see their revenue share increase to double digits [1] - The company has significant R&D investments and a large market potential, aiming to achieve revenue comparable to standard interface niche storage [1] - Zhaoyi Innovation has a first-mover advantage and strong relationships with strategic suppliers, ensuring capacity and process advantages [1] - The niche market remains stable, with production cuts from leading manufacturers creating growth opportunities, and the company plans to launch the LPDDR5 product line within two years [1] - The automotive MCU market is promising, with plans to introduce multi-core products and AI MCUs for AI applications [1] - The 45nm NOR Flash capacity is expected to ramp up, contributing 15% to revenue by year-end, with a complete product line expected by 2026 and a significant cost advantage due to a 20% reduction in chip area [1] Group 2: Aisen Co., Ltd. - Aisen Co., Ltd. has achieved multiple product breakthroughs in wafer, advanced packaging, semiconductor display, and IC substrate fields [2] - The company has successfully mass-produced 28nm process copper plating additives and is testing products in the 5-14nm range [2] - Negative photoresists for glass-based packaging have received mass production orders, and OLED array photoresists have passed validation [2] - Tenting rapid-fill copper plating products have been introduced into the HDI and SLP supply chains [2] - The TSV process relies on high-precision copper plating, and the company's TSV copper plating additives have achieved rapid, void-free filling [2] - Aisen has developed its own photoresist resin covering various types, forming a complete R&D system [2] - The IC substrate market is projected to reach $31 billion by 2030, with the company's copper plating products gradually being pushed into HDI, SLP, and IC substrate applications to increase localization rates [2]