完成三期扩产，年产600台固晶机，芯片封装设备研发商「微见智能」获超亿元B轮融资

Group 1 - The core viewpoint of the article is that Weijian Intelligent has successfully completed over 100 million yuan in Series B financing, with funds primarily allocated for product research and development in advanced packaging technologies for the AI era [1] - Weijian Intelligent, established in December 2019, focuses on the research and production of high-precision complex process chip packaging equipment, particularly the MV series of high-precision die bonding machines, which cater to the packaging needs of third-generation semiconductor chips [1][2] - The company has secured orders from leading domestic and international optical module clients from 2023 to 2024, with revenue growing at an exponential rate [1] Group 2 - The die bonding process is critical in the packaging stage, requiring high precision to ensure product performance, especially in optical communication modules where alignment must be within microns [2] - Weijian Intelligent has developed a 1.5μm series die bonding machine, achieving a cumulative error control within 1.5μm and actual production accuracy of ±3μm, which is a significant improvement over previous domestic products [2][4] - The company faced market challenges initially, but the explosion of AI demand in late 2022 created new opportunities, allowing Weijian Intelligent to validate its technology with benchmark clients [4] Group 3 - Weijian Intelligent is expanding its product line to include sub-micron level products (0.5μm) and 10μm level products, broadening its market reach [5] - The company is also diversifying into storage and computing sectors to create a "transmission-storage-computing" product matrix, addressing the advanced packaging requirements of AI chips [6] - The company has achieved significant improvements in mass production capabilities, with equipment that allows for quick deployment and minimal need for original factory personnel on-site [6] Group 4 - In 2023, Weijian Intelligent successfully exported its 1.5μm high-precision die bonding machines to the European and American markets, with over 20% of total orders coming from exports [7] - The company has completed the expansion of its third delivery center ahead of schedule and is advancing its fourth production line, aiming to enhance its product matrix in optical communication and invest in new growth areas [7]