Core Insights - Hengkun New Materials focuses on the research and industrial application of key materials in the integrated circuit field, being one of the few domestic companies capable of developing and mass-producing 12-inch integrated circuit wafer manufacturing materials [2][3] - The company’s products are essential for the production processes of advanced NAND, DRAM storage chips, and logic chips at 90nm technology nodes and below, including photolithography and thin film deposition [2] Group 1 - Hengkun New Materials has successfully mass-produced and supplied products such as SOC, BARC, i-Line photoresists, KrF photoresists, and TEOS precursor materials, with the number of products supplied continuously increasing as product validation progresses [2] - The company is actively developing new products, including ArF photoresists, SiARC, Top Coating materials, and silicon-based and metal-based precursor materials, with ArF photoresists having passed validation and entered small-scale sales [2] - The total number of products in research, validation, and mass supply has exceeded one hundred [2] Group 2 - In response to the increasing demand for supply chain security in the domestic integrated circuit sector, Hengkun New Materials has adopted an innovative development path of "introducing, digesting, absorbing, and re-innovating" based on its professional understanding and technical accumulation of various processes and key materials in integrated circuit wafer manufacturing [3] - The company serves several leading domestic 12-inch integrated circuit wafer manufacturers, achieving domestic leadership and international advanced levels, thereby replacing foreign counterparts and breaking the monopoly on key materials for 12-inch integrated circuits [3] - Hengkun New Materials is actively participating in collaborative innovation with customers, providing customized development of key materials for product technology iteration, transitioning from following and replacing to leading innovation [3]
恒坤新材IPO上市关注:8月29日上会
Sou Hu Cai Jing·2025-08-26 09:18