OLYMPIC(SH:603920) Zheng Quan Zhi Xing·2025-08-26 11:08Investment Overview - The company plans to invest approximately RMB 1.5 billion in the "Chip Innovation and Intelligent Carrier" new generation PCB manufacturing base project, with an expected production capacity of 660,000 square meters per year [2][3] - The project aims to enhance the production capacity of chip-embedded PCB products and high-end HDI products to meet the increasing demand from downstream customers [2][4] Project Details - The project will be located in the Iron Ridge Industrial Zone, Gonghe Town, Heshan City [3] - The total investment includes RMB 463 million for construction, RMB 962 million for equipment purchase and installation, and RMB 60 million for working capital [3] - The project is expected to start construction in the second half of 2025 and begin production in mid-2026 [2][3] Market Demand and Strategic Importance - The demand for HDI and multilayer boards is projected to grow by 12.9% in 2025, driven by sectors such as artificial intelligence and electric vehicles [4] - The chip-embedded PCB technology offers advantages such as improved reliability, reduced electrical losses, and enhanced thermal performance, making it a key focus for future development [4][5] - The company aims to optimize its product structure and enhance competitiveness in the high-end PCB market, aligning with its long-term strategic goals [4][5] Financial Impact - The project is expected to generate new profit growth points and enhance the company's brand influence, aligning with its high-quality development strategy [5] - The funding for the project will come from the company's own or self-raised funds, which will not significantly impact the company's financial status [5][6] Risk Management - The company acknowledges potential risks related to market competition, project construction delays, and funding challenges, and plans to implement measures to mitigate these risks [6][7]