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兴森科技:公司FCBGA封装基板项目投资超38亿 样品订单数量超过去年全年

Core Viewpoint - The company has significantly invested in its FCBGA packaging substrate project, exceeding 3.8 billion, and is well-prepared for mass production in terms of technical capabilities, production capacity, and product yield [1] Group 1: Investment and Production Readiness - The overall investment scale of the FCBGA packaging substrate project has surpassed 3.8 billion [1] - The company is fully prepared for mass production regarding technical capabilities, production capacity, and product yield [1] - Sample order quantities for the first half of 2025 have already exceeded the total for the entire year of 2024 [1] Group 2: Strategic Expansion - The company is planning to further expand its high-end HDI capacity aimed at the AI sector to seize opportunities arising from the AI boom [1]