Ge Long Hui·2025-08-27 13:03Group 1 - The core viewpoint highlights the essential role of SoC and storage chips in the rapid penetration of AI glasses and toys, as well as the upgrade of traditional IoT and wearable devices, with a projected market space expansion of over 100% within three years [1] - The market is catalyzed by multiple factors, with smart terminal-side chips becoming a highly recognized investment direction, driven by early mass production timelines for new AI glasses and increased demand for high-performance, low-power SoCs from leading domestic manufacturers [1] - Investment is rapidly concentrating on key companies such as Fudan Microelectronics, Hengxuan Technology, and Rockchip, leading to a recovery in the semiconductor sector and a ripple effect across materials, equipment, and packaging segments [1] Group 2 - Key companies in the smart terminal-side chip sector include Fudan Microelectronics (market cap: 195.44 billion), Hengxuan Technology (306.89 billion), and Rockchip (432.27 billion), with each company focusing on specific technological advancements such as AI acceleration and low-power wireless SoCs [3] - The industry is categorized into various segments, including terminal-side SoC chips, storage, modules, and ASICs, with notable companies like Broadcom Integration and Allwinner Technology leading in terminal-side SoC chips [4] - The AI application landscape is diverse, encompassing sectors such as healthcare, education, finance, and gaming, with companies like iFLYTEK and Perfect World actively participating in AI-driven innovations [5]