Core Points - Shentong Express announced the issuance of its first phase of technology innovation bonds for 2025, with a total scale of 700 million yuan and a low interest rate of 2.08% [1] - The bond issuance attracted participation from 13 investment institutions, achieving a subscription multiple of 2.4 times and a marginal multiple of 2.48 times [1] - The raised funds will be used to supplement the working capital of Shentong Express and its subsidiaries, with 50% allocated to Shanghai Shinxue Supply Chain Management Co., Ltd. for operational expenses and technology research and development [1] - The issuance of these bonds is expected to strengthen the company's internal R&D capabilities and support its digital transformation strategy, while also reducing financing costs and improving short-term debt repayment pressure [1]
申通快递发行首期科创债,募集资金规模7亿元