通富微电：8月27日召开董事会会议

Group 1 - The company Tongfu Microelectronics (SZ 002156) announced its eighth board meeting held on August 27, 2025, via telecommunication to review the 2025 semi-annual report and summary [1] - For the year 2024, the revenue composition of Tongfu Microelectronics is as follows: integrated circuit packaging and testing accounts for 95.97%, while sales of molds and materials account for 4.03% [1] - As of the report date, the market capitalization of Tongfu Microelectronics is 45.6 billion yuan [1]