2026 年 3 月 27 日 刘梦麟 SAC 执业证书编号： S0340521070002 电话：0769-22110619 邮箱： liumenglin@dgzq.com.cn 周 报 资料来源：东莞证券研究所，iFind 证 超配（维持） 半导体行业双周报（2026/03/13-2026/03/26） 行 业 存储价格持续上涨压制消费类电子需求 投资要点： 本报告的风险等级为中高风险。 本报告的信息均来自已公开信息，关于信息的准确性与完整性，建议投资者谨慎判断，据此入市，风险自担。 请务必阅读末页声明。 半导体行业 半导体行业指数近两周涨跌幅：截至2026年3月26日，申万半导体行业指 数近两周（2026/03/13-2026/03/26）累计下跌5.51%，跑输沪深300指 数1.03个百分点；2026年以来申万半导体行业指数累计上涨2.17%，跑 赢沪深300指数5.46个百分点。 半导体行业（申万）指数走势 行业新闻与公司动态：（1）多家手机厂商宣布调价；（2）IDC：2025年 中国智能眼镜市场出货量246万台，同比增长87.1%；（3）英伟达CEO黄 仁勋：AGI时代已经到来，"龙虾开公司"不 ...

证券代码：002156 证券简称：通富微电 公告编号：2026-017 通富微电子股份有限公司 第八届董事会第十七次会议决议公告 本公司及董事会全体成员保证信息披露内容的真实、准确和完整，没有虚 假记载、误导性陈述或重大遗漏。 通富微电子股份有限公司（以下简称"公司"）第八届董事会第十七次会议， 于 2026 年 3 月 13 日以电子邮件的方式发出会议通知，各位董事已知悉与所议事 项相关的必要信息，公司第八届董事会第十七次会议于 2026 年 3 月 20 日以通讯 表决方式召开。公司全体 9 名董事均行使了表决权，会议实际有效表决票 9 票。 会议召开符合有关法律、行政法规、部门规章、规范性文件和公司章程的规定。 二、 董事会会议审议情况 1.审议通过了《关于为下属控制企业提供担保的议案》 钜天投资有限公司（以下简称"钜天投资"）为公司间接持股的全资子公司， 具备偿还债务的能力，公司为钜天投资提供担保可以满足其正常经营及资金需要， 不存在与《公司法》、中国证监会相关规定及《公司章程》相违背的情况，公司 为其提供担保的财务风险处于公司可控的范围内，不会对公司的正常运作和业务 发展造成不良影响。公司董事会同意 ...

通富微电子股份有限公司 关于为下属控制企业提供担保的公告 本公司及董事会全体成员保证信息披露内容的真实、准确和完整，没有虚假记 载、误导性陈述或重大遗漏。 一、担保情况概述 2025 年 3 月 20 日，通富微电子股份有限公司（以下简称"公司"）召开第八届 董事会第十七次会议，审议通过了《关于为下属控制企业提供担保的议案》。 为满足公司间接持股的全资子公司钜天投资有限公司（以下简称"钜天投资"） 正常经营及资金需要，同意公司为钜天投资提供以下额度的担保，担保方式包括但 不限于信用担保、保函担保、质押或抵押担保、融资租赁担保等。 本次担保事项在董事会审批权限范围内，无需提交公司股东会审议。 | 担保方 | 被担保方 | 担保 方持 | 被担保方最 | 截至目前担 | 本次新增担保额 | 担保额度占上市 | 是否 | | --- | --- | --- | --- | --- | --- | --- | --- | | | | 股比 | 近一期资产 | 保余额(单位 | 度 | 公司最近一期经 | 关联 | | | | 例 | 负债率 | 万元) | | 审计净资产比例 | 担保 | | | | | | | 不 ...

存储产业链是半导体产业的核心支柱赛道，贯穿上游核心设备与关键材料、中游芯片设计与晶圆制造、 下游先进封测与存储模组应用全环节，更是支撑AI服务器、车载电子、工业控制、物联网、云计算等 下游高景气领域的底层硬件基石，没有完整的存储产业链配套，就无法实现核心算力硬件的自主可控。 近年来，在国产替代全面提速、全球AI算力爆发式增长、车载与工业存储高端化升级三重核心红利驱 动下，国内存储产业链上下游龙头企业订单量全线攀升，多家头部企业在手订单规模突破百亿，订单排 期横跨数年，行业整体高景气度与业绩增长确定性持续凸显，产业链自主化进程全面提速。 下文结合企业官方公开信息，深度拆解国内存储产业链TOP10的核心龙头企业，覆盖设计、制造设备、 封测、模组全环节，全方位梳理各家企业核心实力、产品布局、市场壁垒与长期增长逻辑。 第十名：聚辰股份（Giantec） 企业官方定位 聚辰股份2009年成立于上海张江，2019年登陆科创板，是一家专注于集成电路设计的高新技术企业，定 位全球化的非易失性存储芯片及混合信号芯片供应商，深耕存储芯片、音圈马达驱动芯片等领域多年， 建立了覆盖全球的客户体系与销售网络，核心产品广泛应用于智能手机 ...

Core Viewpoint - The CPO concept stocks in the A-share market have shown strong performance, particularly following the announcement of NVIDIA's Feynman chip, which integrates optical communication to significantly reduce energy consumption in AI data center communications by over 70% [1]. Group 1: Stock Performance - Resconda (603803) saw a price increase of 9.97%, with a total market capitalization of 5.579 billion and a year-to-date increase of 18.39% [2]. - Tianfu Communication (300394) rose by 6.94%, with a market cap of 232.8 billion and a year-to-date increase of 47.48% [2]. - Kechuan Technology (603052) increased by 6.70%, with a market cap of 1.16 billion and a year-to-date increase of 95.21% [2]. - Dekeli (688205) experienced a 6.04% rise, with a market cap of 2.72 billion and a year-to-date increase of 24.92% [2]. - Aerospace Electric (002025) rose by 5.71%, with a market cap of 2.69 billion and a year-to-date increase of 17.81% [2]. - Xinyi Technology (300502) increased by 4.28%, with a market cap of 40.35 billion and a year-to-date decrease of 5.78% [2]. - Other notable stocks include Zhili Fang (301312) up 3.76%, Juguang Technology (688167) up 3.40%, and Luobotek (300757) up 3.30% [2]. Group 2: Market Trends - The overall trend in the CPO concept stocks indicates a positive market sentiment, driven by technological advancements in optical communication [1]. - The introduction of NVIDIA's Feynman chip is expected to have a significant impact on the energy efficiency of AI data centers, which may further boost investor interest in related stocks [1].

Group 1 - The core viewpoint of the article highlights the strong performance of CPO concept stocks in the A-share market, particularly noting the significant gains of various companies following the announcement of a new chip by Nvidia [1] Group 2 - Risconda saw a limit-up increase, while Tianfu Communication, Kechuan Technology, and Dekeli rose over 6% [1] - Aerospace Electric increased by over 5%, and Xinyi Sheng rose by over 4% [1] - Other companies such as Zhili Fang, Juguang Technology, Robotec, Xiechuang Data, and Tongfu Microelectronics experienced gains of over 3% [1] Group 3 - The news is driven by Nvidia's announcement on March 16 regarding the Feynman chip, which integrates optical communication for inter-chip connectivity, potentially reducing AI data center communication energy consumption by over 70% [1]

Group 1 - The combination of HBM and CoWoS has become the standard for AI and computing chips, driving a surge in advanced packaging demand, with the global OSAT industry expected to achieve sales of 333.2 billion yuan in 2025, a year-on-year increase of 9.9% [2][7] - Advanced packaging's future key technology directions focus on material and architecture innovations, including changes in 2.5D interposer layers, the use of glass in packaging, and high-integration architectures like CPO [2][15] - Domestic OSAT manufacturers in China are rapidly emerging under the backdrop of domestic substitution, with expectations for advanced process supply expansion in 2026 to exceed forecasts, particularly in AI-related computing chips [2][35] Group 2 - The OSAT industry is entering a peak capital expenditure phase, with both TSMC and non-TSMC camps increasing their CoWoS capacity expansion plans for 2026, leading to an expanded market presence for OSAT in AI chips [2][23] - Key companies to watch include Tongfu Microelectronics, which is enhancing high-end packaging in collaboration with AMD, and Shenghe Jingwei, a leader in the domestic 2.5D platform [2][56][59] - The advanced packaging market is expected to see significant growth, with domestic manufacturers likely to follow suit in price increases and capacity expansions due to rising costs in packaging services [2][50][47] Group 3 - The global OSAT market is projected to reach a historical high in 2025, driven by HPC and AI applications, with advanced packaging becoming a critical path for enhancing system performance [4][12] - The importance of advanced packaging is increasing as it becomes essential for meeting the complex application demands of downstream industries, especially in high-performance computing and AI [12][28] - The trend towards panel-level packaging (PLP) and glass substrates is expected to become significant in advanced packaging technology, enhancing production efficiency and capacity [24][27]

Investment Rating - The report maintains a "Positive" investment rating for the electronic industry, indicating a favorable outlook for the sector [5]. Core Insights - SRAM is expanding its applications in AI inference, with stacking solutions aiding in capacity expansion. This presents significant investment opportunities in related companies [3][8]. - The report highlights the potential of SRAM architecture in AI inference, emphasizing its high access speed and low latency, which are critical for data requiring quick access [7]. - The industry is witnessing a trend towards 3D stacking solutions for SRAM, which can enhance density and overcome traditional capacity limitations [7]. Summary by Sections Investment Recommendations and Targets - Key companies to watch include: - Zhaoyi Innovation (兆易创新) and Beijing Junzheng (北京君正) for customized storage solutions [3][8]. - Hengshuo Co., Ltd. (恒烁股份) for SRAM-based digital computing solutions [3][8]. - Changdian Technology (长电科技) and Tongfu Microelectronics (通富微电) for advanced packaging [3][8]. - Companies like Deep South Circuit (深南电路) and Huitian Technology (沪电股份) are expected to benefit from NVIDIA's new chip solutions [3][8]. - Upstream PCB companies such as Shengyi Technology (生益科技) and Nanya Technology (南亚新材) are also highlighted [3][8]. Industry Developments - NVIDIA is set to unveil new AI inference chip solutions at the GTC 2026 conference, which could drive further SRAM applications [7]. - The report notes that SRAM's architecture is gaining recognition for its potential in AI inference, particularly for small parameter models and intermediate results [7]. - The 3D stacking technology, such as AMD's 3D V-Cache, is noted for its ability to significantly increase SRAM cache capacity [7][15].

Investment Rating - The report maintains a "Recommended" rating for companies such as 中芯国际 (SMIC) and 通富微电 (Tongfu Microelectronics) [2][3] Core Insights - The electronic industry is experiencing a comprehensive "inflation" phase, with multiple segments seeing price increases due to supply chain constraints and rising raw material costs [7][34] - AI demand is driving price hikes in PCB upstream materials, with significant increases in costs for electronic cloth and copper foil, leading to a new round of price increases in the CCL (Copper Clad Laminate) sector [10][17] - The MLCC (Multi-Layer Ceramic Capacitor) market is entering a price increase cycle, driven by high demand from AI servers and supply constraints from leading manufacturers [31][32] Summary by Sections 1. AI Demand Driving Price Increases in PCB Upstream Materials - The CCL industry has initiated a new round of price increases, with Japanese manufacturers announcing price hikes of over 30% for copper foil substrates and adhesive films [10] - The demand for high-end products is squeezing traditional production capacities, leading to a tighter supply-demand balance in electronic cloth [19] - The HVLP (High Voltage Low Profile) copper foil market is experiencing an expanding supply gap, enhancing the industry's pricing power [24] 2. AI Industry Driving Demand for MLCC - The MLCC sector is seeing a surge in prices, with a nearly 20% increase in spot prices for Korean MLCCs and leading manufacturers considering price hikes due to sustained high demand [31][32] - The supply-demand balance for high-end MLCCs is tight, with production rates at leading companies reaching 90-95%, indicating a potential for continued price increases [32] 3. Upstream Raw Material Price Increases and Semiconductor Price Trends - The semiconductor industry is expected to continue its price increase trend due to rising raw material costs and tight supply conditions [34] - Power semiconductors are also entering a new price increase phase, with companies like 新洁能 (New Clean Energy) announcing price hikes of at least 10% due to increased manufacturing costs [34] 4. Market Review - The electronic sector saw a weekly increase of 4.02%, outperforming the Shanghai and Shenzhen 300 index by 2.94 percentage points [37] - Year-to-date, the electronic sector has risen by 14.94%, again outperforming the broader index [37]

Investment Rating - The report maintains a "Recommended" rating for companies such as 中芯国际 (SMIC) and 通富微电 (Tongfu Microelectronics) [2][3] Core Insights - The electronic industry is experiencing a comprehensive "inflation" phase, with multiple segments seeing price increases due to rising costs and supply chain constraints [7][34] - AI demand is driving price hikes in PCB upstream materials, with significant increases in costs for electronic cloth and copper foil, leading to a new round of price increases in the CCL (Copper Clad Laminate) sector [10][17] - The MLCC (Multi-Layer Ceramic Capacitor) market is entering a price increase cycle, driven by high demand from AI servers and supply constraints from leading manufacturers [31][32] Summary by Sections 1. AI Demand Driving Price Increases in PCB Upstream Materials - The CCL industry has initiated a new round of price increases, with Japanese manufacturers announcing price hikes of over 30% for copper foil substrates and adhesive films [10] - The demand for high-end products is squeezing traditional production capacities, leading to tighter supply in electronic cloth [19] - The HVLP (High Voltage Low Profile) copper foil market is experiencing an expanding supply-demand gap, enhancing the industry's pricing power [24] 2. AI Industry Driving Demand Upward, MLCC Enters Price Increase Cycle - The MLCC sector is seeing a surge in prices, with a nearly 20% increase in spot prices and leading manufacturers considering price hikes due to sustained high demand from AI applications [31][32] - The global high-end MLCC market is currently in a state of supply-demand imbalance, with utilization rates of leading manufacturers reaching 90%-95% [32] 3. Upstream Raw Material Price Increases + AI Demand Driving Semiconductor Price Increases - The semiconductor industry is expected to continue its price increase trend due to rising raw material costs and tight supply of 8-inch wafers [34] 4. Market Review - The electronic sector saw a weekly increase of 4.02%, outperforming the CSI 300 index by 2.94 percentage points, with a year-to-date increase of 14.94% [37]