飞凯材料：公司已在先进封装材料产品研发方面取得一定成果

Core Viewpoint - The company has made significant advancements in the field of advanced packaging materials, focusing on functional wet electronic chemicals, solder balls, and EMC epoxy encapsulants [1] Group 1: Product Development - The company has achieved a major technological breakthrough with its self-developed thick film negative photoresist for semiconductor advanced packaging, which is well-suited for 2.5D/3D advanced packaging processes and exhibits excellent performance such as high resolution [1] - The company has established a product system for temporary bonding materials, primarily based on thermal and mechanical debonding, supplemented by laser debonding [1] Group 2: Sales and Market Strategy - Current products have achieved small-scale sales, and the company plans to gradually increase production volume based on customer validation progress [1] - The company aims to continuously expand its advanced packaging-related business, enhance product research and development, and upgrade technology to meet customer needs through customized development [1]