Core Insights - The semiconductor industry is experiencing a surge in mergers and acquisitions (M&A), driven by policy incentives and technological integration needs, with 139 M&A events reported by August 28, 2025, compared to 115 in the same period of 2024, marking a growth of 24 events [3][4] - The M&A activities are characterized by "strong alliances" and "curved listings," focusing on equipment, materials, and design sectors, particularly in etching equipment, photoresists, and silicon carbide [3][4] Policy Empowerment - Policies such as the "315 New Policy," "National Nine Articles," and "M&A Six Articles" have significantly lowered barriers for M&A, providing strong support for equity investment and restructuring in the semiconductor sector [4][5] - Local governments, like Shanghai, have established funds and action plans to support M&A, enhancing capital market attention towards the semiconductor sector [5][6] Market Dynamics - The active M&A market is expected to lead to larger-scale transactions, with significant capital flow enhancing market vibrancy [5] - The integration of various financing tools and support from financial institutions is facilitating M&A activities, allowing for resource optimization and enhanced core competitiveness [6][10] Challenges and Risks - There have been 7 failed M&A cases in the semiconductor sector this year, primarily due to valuation bubbles, insufficient synergy, and high technical integration difficulties [7][8] - The performance pressure on both acquirers and targets is evident, with many companies facing declining profits amid high inventory levels in the global semiconductor market [8][9] Future Trends - Future M&A activities in the semiconductor industry are expected to shift from horizontal integration to ecosystem mergers, with a focus on cross-border acquisitions and value creation rather than mere scale expansion [13][14] - The emphasis will be on deep integration around strategic emerging technologies and building a complete industrial ecosystem, moving beyond simple chip design or manufacturing [14]
年内半导体并购重组已达139例 政策红利驱动整合