三张图了解国内半导体产业链布局

Core Insights - The article discusses the increasing domestic production rates of semiconductor equipment in China across various manufacturing segments, highlighting the growth potential and market size for 2024 [2][4]. Group 1: Market Size and Growth - The global market size for wafer manufacturing is projected to reach $60 billion in 2024, with various equipment segments showing significant growth in domestic production rates [2][4]. - The estimated market size for different semiconductor equipment segments includes: - Thermal processing equipment: $3.15 billion - Thin film deposition equipment: $25.63 billion - Etching equipment: $18.09 billion - Lithography equipment: $25.84 billion - CMP equipment: $2.98 billion - Cleaning equipment: $6.57 billion - Coating and developing equipment: $3.53 billion - Testing/measurement equipment: $14.25 billion [2]. Group 2: Domestic Production Rates - The domestic production rates for various equipment segments are as follows: - Thermal processing equipment: increased from ~11% in 2021 to ~23% in 2024 - Thin film deposition equipment: increased from ~5% in 2021 to ~19% in 2024 - Etching equipment: increased from ~11% in 2021 to ~28% in 2024 - CMP equipment: increased from ~18% in 2021 to ~40% in 2024 - Cleaning equipment: increased from ~26% in 2021 to ~32% in 2024 - Coating and developing equipment: increased from ~7% in 2021 to ~10% in 2024 - Testing/measurement equipment: increased from ~3% in 2021 to ~5% in 2024 [2][3]. Group 3: Key Domestic Companies - Major domestic companies involved in semiconductor equipment manufacturing include: - North Huachuang and Yitang Co. for thermal processing and etching equipment - Zhongwei Company and Tuo Jing Technology for thin film deposition equipment - Shengmei Shanghai and North Huachuang for cleaning equipment - Chip measurement and testing companies like Jingce Electronics and Zhongke Feimeng [2][3].