QUICK CO.,(SH:603203) Xin Lang Cai Jing·2025-09-04 02:49Company Overview - The company is a leading player in the welding equipment sector, expanding its product categories and application layouts. Founded in 1993, it is a specialized intelligent equipment supplier, with revenue projected to grow from 230 million to 945 million yuan from 2015 to 2024, reflecting a CAGR of 17.00%. The main products include intelligent manufacturing equipment, precision welding assembly equipment, machine vision process equipment, and die bonding packaging equipment. The company focuses on multiple industry applications, including semiconductor packaging, new energy vehicle electrification, intelligent terminals, and precision electronics [1]. Industry Trends - The company benefits from the innovation in 3C products, automation, and the trend of going global, which supports rapid growth in its main business. In the consumer electronics sector, the AI-driven transformation is accelerating, with a faster iteration of hardware terminal intelligence. The company has effectively seized opportunities in the structural upgrade of AI consumer electronics, achieving breakthroughs in technology innovation and business expansion [2]. - In the industrial inspection field, the demand for machine vision as a core technology continues to grow with the acceleration of smart manufacturing. The company focuses on standardized inspection in the SMT process, full inspection in intelligent terminals and wearables, and various detection needs in AI servers, optical modules, and semiconductor packaging [2]. Semiconductor Business - The semiconductor business is centered around power layout and has established partnerships with major clients, entering a volume growth cycle. The global semiconductor packaging equipment market is expanding due to AI and new energy, with SEMI predicting a 7.7% increase in global packaging equipment sales to reach 5.4 billion USD by 2025. The company has made breakthroughs in carbon silicon and discrete device packaging equipment, collaborating with leading companies such as Huichuan, CRRC, BYD, and others [3]. - The company is actively entering the CoWos advanced packaging field, with TCB equipment development progressing smoothly, and is expected to complete R&D and initiate customer sampling by 2025, indicating promising future prospects [3].