Zhi Tong Cai Jing·2025-09-05 05:56Core Insights - The demand for thermal interface materials (TIM) is rapidly increasing due to the rising thermal power consumption of electronic components driven by high-density chips and packaging technologies [1][2][3] - The TIM market in China has grown from 975 million yuan in 2018 to 1.875 billion yuan in 2023, with a compound annual growth rate (CAGR) of 13.97% [1] - TIM1 and TIM2 serve as a "dual thermal conduction engine" in chip cooling, with TIM1 requiring low thermal resistance and high thermal conductivity, while TIM2 balances cooling efficiency and cost [1][3] Industry Overview - TIM is widely used in various sectors including computers, consumer electronics, telecommunications infrastructure, and automotive applications, primarily to fill micro-gaps between heat-generating and heat-dissipating components [2] - The increasing performance and power consumption of devices such as smartphones and tablets are driving the evolution of cooling solutions, leading to higher penetration of high thermal conductivity materials [3] - Emerging materials like diamond and graphene are expected to enhance the cooling capabilities of TIM, with domestic companies likely to increase their market share as they overcome research and development barriers [4]