光莆股份：目前公司的光集成传感3D叠Die封装产品主要应用在智能手机等产品中

Group 1 - The core viewpoint of the article highlights that Guangpu Co., Ltd. (300632) is actively engaging with investors regarding its 3D stacked die packaging products, which are primarily used in various advanced technologies such as smartphones, smart wearables, drones, robots, and AR/VR devices [1] - The company's 3D stacked packaging technology is derived from high bandwidth memory (HBM) technology, indicating a potential for technological synergy and expanded applications in the market [1]