Core Points - Shenzhen Lihua Science and Technology Innovation Co., Ltd. has successfully completed the issuance of its second phase of technology innovation bonds for the year 2025, with a total issuance amount of RMB 700 million and an interest rate of 1.95% [1][3][5] Group 1: Bond Issuance Details - The company held a temporary shareholders' meeting on July 7, 2023, to approve the public issuance of corporate bonds, medium-term notes, and short-term financing bills [1] - The company received a registration acceptance notice from the China Interbank Market Dealers Association on November 2023, allowing for the registration of medium-term notes with a total amount of RMB 2 billion, valid for two years [1] - The first phase of medium-term notes for 2025 was completed on April 7, 2025, with a total issuance of RMB 700 million and an interest rate of 2.18% [3] Group 2: Specifics of the Second Phase Bond - The second phase of technology innovation bonds was completed on September 4, 2025, with a total issuance of RMB 700 million and an interest rate of 1.95% [3][5] - The bonds have a term of 3 years, with the interest starting from September 4, 2025, and maturing on September 4, 2028 [3] - The issuance price was set at 100.00, with a total of 14 compliant subscription applications amounting to RMB 1.57 billion [3][5]
力合科创: 关于公司2025年度第二期科技创新债券发行情况的公告