TSMC(US:TSM) Xin Hua Wang·2025-09-07 05:15Group 1 - SEMICON Taiwan 2025 will focus on AI, CoWoS advanced packaging, and testing mass production progress from September 10-12 [1] - The semiconductor industry is facing bottlenecks in process miniaturization, with heterogeneous integration and advanced packaging emerging as breakthrough directions [1] - Demand for AI, high-performance computing (HPC), and HBM is increasing, making advanced packaging technologies like 3D IC and panel-level fan-out packaging core to semiconductor innovation [1] Group 2 - TSMC's CoWoS, InFO, and SoIC advanced packaging technologies are applicable for AI and HPC chips, with CoWoS already in mass production [1] - NVIDIA and AMD have strong ongoing demand for CoWoS, while Apple requires TSMC's InFO technology for high-end processors [1] - TSMC is expanding its CoWoS and InFO advanced packaging lines in the U.S. due to strong demand and U.S. government support for domestic semiconductor manufacturing [1] Group 3 - TSMC announced a $100 billion investment in advanced semiconductor manufacturing in the U.S., totaling $165 billion, which includes two advanced packaging facilities [2] - TSMC aims to balance the supply-demand gap for CoWoS advanced packaging, with expected monthly capacity exceeding 90,000 to 95,000 pieces by the end of 2026 [2] - Non-TSMC CoWoS capacity is projected to reach 12,000 pieces monthly by the end of next year, with nearly 60% of overall annual capacity still supplied to NVIDIA [2]