南芯科技：拟发行可转债募资不超19.33亿元 用于智能算力等领域项目

Core Viewpoint - Nanchip Technology (688484.SH) plans to issue convertible bonds to raise up to 1.933 billion yuan for various chip development projects aimed at enhancing core competitiveness and profitability [1] Group 1: Fundraising and Projects - The company intends to raise a total of no more than 1.933 billion yuan through the issuance of convertible bonds [1] - The funds will be allocated to projects in smart computing power, automotive chips, and industrial application sensors and control chips [1] - These projects align with national policy directions and market demands, indicating a strategic focus on growth areas [1]