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南芯科技拟发行可转债募集不超19.33亿元 用于多项芯片研产项目
Southchip Semiconductor Technology(Shanghai) Southchip Semiconductor Technology(Shanghai) (SH:688484) Zhi Tong Cai Jing·2025-09-07 08:50

Group 1 - The company plans to issue up to 19.33 million convertible bonds, raising a total of up to RMB 1.933 billion [1] - The initial conversion price will not be lower than the average trading price of the company's A-shares over the previous twenty trading days and the last trading day before the announcement [1] - The net proceeds from the fundraising will be used for the development and industrialization of power management chips in the intelligent computing field, automotive chips, and sensor and control chips for industrial applications [1]