华海清科王科：先进封装与第三代半导体拉动CMP需求大增

Core Insights - The strategic value of semiconductor equipment is highlighted, with electronic terminal products accounting for a significant portion of global output, driven by the explosion of industries like big data and AI, which rely on chip manufacturing supported by semiconductor equipment [2] - CMP (Chemical Mechanical Polishing) is identified as one of the five key technologies in integrated circuit manufacturing, essential for flattening wafer surfaces to facilitate subsequent processes like lithography [2] - Current challenges in CMP include achieving nanoscale wafer flattening, cleaning nanoscale contaminants, maintaining precision in rapid polishing, and ensuring efficient operation of the entire system [2] - The global flatness requirement for 12-inch wafers has increased to less than 5nm, with strict limits on the number of fine contaminants above 28nm [2] Opportunities - The demand for CMP in advanced packaging is expected to rise significantly, driven by the rapid development of technologies like TSV and 3D packaging [3] - The transition from multi-wafer polishing to single-wafer polishing in third-generation semiconductors is leading to a sustained increase in demand for CMP equipment [3] - Huahai Qingshi, a leading domestic semiconductor equipment supplier, has evolved from a CMP equipment provider to a platform enterprise covering various equipment and services, including thinning, cutting, wet processing, ion implantation, and edge polishing [3] - The company emphasizes that industry demand and technological iteration will continue to drive progress in the sector, with a commitment to innovation based on years of technical accumulation [3]