通富微电：公司在光电合封（CPO）领域的技术研发取得突破性进展，相关产品已通过初步可靠性测试

Group 1 - The company, Tongfu Microelectronics (002156.SZ), announced a breakthrough in technology research and development in the field of Chip-on-Photonic (CPO) as of September 8, 2023 [1] - The related products have passed preliminary reliability testing, indicating progress in their development [1] - Future developments will be determined based on customer and market demand [1] Group 2 - An investor inquired whether the CPO products have been sent to GPU manufacturers for certification, reflecting interest in the company's advancements [3]