乐鑫科技17.78亿元再融资项目注册生效,将投建Wi-Fi 7路由器芯片等项目

Core Viewpoint - Lexin Technology (Shanghai) Co., Ltd. plans to raise up to 1.78 billion RMB through a private placement of A-shares to enhance its core competitiveness and market position by investing in various technology innovation projects [2][6]. Fundraising Details - The total amount to be raised is capped at 1.78 billion RMB [4]. - The fundraising has been registered and is effective as of August 28, 2025 [3]. - The issuance will target no more than 35 specific entities, including securities investment fund management companies, securities companies, and trust companies [5]. Investment Projects - Wi-Fi 7 Router Chip R&D and Industrialization Project: Investment of 398.52 million RMB aimed at developing router chips supporting Wi-Fi 7 technology [5]. - Wi-Fi 7 Smart Terminal Chip R&D and Industrialization Project: Investment of 249.86 million RMB focused on developing Wi-Fi 7 chips for smart terminal devices [5]. - AI Edge Chip R&D based on RISC-V Self-Developed IP: Investment of 431.76 million RMB to develop AI edge chips based on RISC-V architecture [5]. - Shanghai R&D Center Construction Project: Investment of 597.73 million RMB to enhance R&D capabilities and technological innovation [5]. - Supplementary Working Capital: 100 million RMB to improve liquidity for daily operations [5]. Strategic Goals - The fundraising aims to further develop the company's business and enhance its competitiveness in the IoT chip design sector [6]. - The company intends to continuously monitor trends in IoT technology and increase R&D investment to improve product performance and innovation capabilities [6]. - The plan has received approval from the company's board and shareholders, as well as regulatory approval from the Shanghai Stock Exchange and the China Securities Regulatory Commission [6].