通富微电：2025年上半年，公司在光电合封（CPO）领域的技术研发取得突破性进展

Core Viewpoint - Tongfu Microelectronics (002156) announced a breakthrough in technology research and development in the optoelectronic packaging (CPO) field, with related products passing preliminary reliability tests [1] Group 1 - The company achieved significant progress in CPO technology research and development by the first half of 2025 [1] - The subsequent developments will be assessed based on customer and market demand [1]