通富微电：公司紧跟行业技术发展趋势

Core Viewpoint - The company is actively developing advanced packaging technologies and expanding its production capacity to seize market opportunities and enhance its competitive edge in the semiconductor industry [2]. Group 1: Company Strategy - The company is focusing on high value-added products and market hotspots, aligning with industry technology trends [2]. - It is investing in the development of advanced packaging technologies such as fan-out, wafer-level, and flip-chip packaging [2]. - The company is also strategically positioning itself in cutting-edge packaging technologies like Chiplet and 2D+ to create a differentiated competitive advantage [2].