USC(SH:688403) Xin Lang Cai Jing·2025-09-09 07:33Core Viewpoint - The company, Hefei Xinhui Microelectronics Co., Ltd., specializes in advanced packaging and testing services for integrated circuits, with a focus on chiplet technology and significant growth in revenue and profit. Group 1: Company Overview - Hefei Xinhui Microelectronics was established on December 18, 2015, and went public on August 18, 2022. The company is located in Hefei, Anhui Province, and its main business involves gold bumping, wafer testing, and various packaging processes for display driver chips, which account for 90.25% of its revenue [7] - The company has been recognized as a "specialized, refined, distinctive, and innovative" small giant enterprise, indicating its strong market position and innovation capabilities [5] Group 2: Financial Performance - For the first half of 2025, the company achieved operating revenue of 866 million yuan, representing a year-on-year growth of 28.58%, and a net profit attributable to shareholders of 96.04 million yuan, up 60.94% year-on-year [8] - The company has distributed a total of 161 million yuan in dividends since its A-share listing [8] Group 3: Research and Development - The company is investing heavily in research and development, with an expenditure of 89.41 million yuan in the latest reporting period, reflecting a 13.38% increase compared to the previous year [2] - The company is focusing on expanding its capabilities in advanced packaging technologies, including Fan-out, 2.5D/3D, and System in Package (SiP) [2] Group 4: Market Position and Trends - The company benefits from a significant overseas revenue share of 54.15%, aided by the depreciation of the Chinese yuan [5] - The company is positioned within the semiconductor industry, specifically in the integrated circuit packaging and testing sector, and is part of various concept sectors including specialized and innovative enterprises [7]