中天精装：公司基于现阶段业务布局与未来发展规划，对经营范围进行相应调整

Core Viewpoint - The company is adjusting its business scope based on current operations and future development plans, including the establishment of a new subsidiary focused on semiconductor packaging and testing equipment by the first half of 2025 [1] Group 1: Business Adjustments - The company plans to invest in high-quality enterprises in the HBM design, advanced packaging, and semiconductor ABF substrate sectors to promote collaborative development among its subsidiaries [1] - The new subsidiary will be a controlling entity aimed at expanding the company's footprint in the semiconductor industry [1] Group 2: Financial Reporting - The company has indirect stakes in several semiconductor technology firms, including Ke Rui Si Semiconductor Technology (Dongyang) Co., Ltd., Hefei Xin Feng Technology Co., Ltd., and Shenzhen Yuanjian Zhichun Technology Co., Ltd., which are not included in the company's consolidated financial statements and are accounted for using the equity method [1] - Further details regarding the company's main business operations and the performance of its subsidiaries will be available in the 2025 semi-annual report, scheduled for release on August 30, 2025 [1]