Core Viewpoint - The upcoming Apple event on September 10 will introduce the iPhone 17 Pro series, featuring a new VC heat spreader design to enhance thermal performance compared to the current graphene heat sinks [1][3] Group 1: Product Features - The iPhone 17 Pro Max is expected to adopt a horizontal motherboard design, which, combined with the VC heat spreader, will help dissipate heat more evenly from the device's back [3] - The VC heat spreader is a sealed metal chamber containing a small amount of liquid that vaporizes when the phone heats up, allowing for efficient heat dissipation through a continuous cycle of vaporization and condensation [3] - Compared to traditional graphite solutions, the VC heat spreader can balance heat more quickly and prevent localized overheating, ensuring sustained high performance from the chip [3] Group 2: Market Impact - As of June 2025, global sales of the iPhone 16 series have surpassed 130 million units, indicating strong demand for Apple's products [3] - The introduction of VC heat spreader technology in standard iPhone models is expected to significantly drive the expansion of the thermal component market [3]
iPhone 17明天发布！Pro系列被曝首用VC散热，供应商瑞声科技(2018.HK)