Core Insights - The company has achieved multiple technological breakthroughs and industrialization results in the AR/VR glasses sector, leveraging its core technologies in optical optoelectronics and semiconductors [2] - The company is currently in a capacity ramp-up phase, with several products, including ultrasonic fingerprint chip acoustic layers and image sensor (CIS) optical path solutions, having reached mass production [2] - The new facility in Hangzhou is progressing as planned, with the entire construction project expected to complete planning acceptance by June 2025 [2] Production and Capacity - The company has successfully developed semiconductor process bonding prisms, which have received customer recognition, and is gradually increasing production capacity with new products [2] - The utilization rate of production capacity is expected to continue improving as existing products ramp up and new products enter mass production [2] Future Outlook - The company plans to continue focusing on niche areas within the optical optoelectronics and semiconductor industries, with rapid growth observed in semiconductor acousto-optics and semiconductor packaging businesses [2] - New products such as semiconductor process bonding prisms and MicroLED are anticipated to drive future business growth [2]
美迪凯:MicroLED项目完成全流程工艺开发,已进入小批量投产阶段