全球首个RISC-V存算一体标准研制工作启动

Core Insights - The Chinese chip industry is facing three major challenges: limitations in advanced process technology, reliance on a closed software ecosystem, and bandwidth bottlenecks due to traditional architecture [1][2][3][4] Group 1: Challenges in the Domestic Chip Industry - The lack of advanced manufacturing processes has resulted in a bottleneck in computing density, with current domestic 3nm/5nm technologies still in the R&D phase and unable to meet the demands of large AI models [2] - The domestic AI chip industry is heavily dependent on Western closed-source ecosystems, particularly the CUDA ecosystem, which monopolizes AI model training and inference software, leading to a situation where high-performance chips may lack compatible software [3] - Traditional von Neumann architecture separates computing and storage units, causing data to be frequently moved via buses, creating a "memory wall" bottleneck that significantly reduces inference efficiency as model parameters scale to hundreds of billions [4] Group 2: 3D-CIM Technology as a Solution - The 3D-CIM (3D Compute-in-Memory) technology, introduced by Micronano Core, integrates computing capabilities within storage, addressing the exponential growth in computing demands for AI models [5] - This technology utilizes SRAM compute-in-memory combined with DRAM 3D stacking to perform computations within the memory, fundamentally eliminating data transfer overhead and is seen as a key path for sustaining computing growth in the post-Moore's Law era [5] - The core breakthrough of 3D-CIM lies in its SRAM compute-in-memory design, which allows for in-situ tensor computations, significantly enhancing computing density and achieving performance comparable to traditional NPU/GPU at a lower manufacturing cost [5][6] Group 3: Ecosystem and Application Prospects - The open and flexible RISC-V architecture complements the 3D-CIM technology, meeting the high parallelism and low power consumption needs of AI models while alleviating external process restrictions [7] - Micronano Core is collaborating with upstream and downstream enterprises to promote the ecological implementation of 3D-CIM technology and RISC-V architecture [8] - The application prospects for 3D-CIM technology are categorized into short-term, mid-term, and long-term, with initial applications in edge AI devices, followed by cloud-based AI model applications, and eventually expanding into embodied intelligence applications [8]