Core Viewpoint - The article highlights the significant advancements made by Xinhenghui in the integrated circuit packaging industry, emphasizing its role in breaking overseas technology monopolies and contributing to China's self-sufficiency in this sector [1][2]. Group 1: Company Overview - Xinhenghui has established itself as a key player in the integrated circuit industry by integrating research, production, sales, and testing services for packaging materials [1]. - The company has built strong technical barriers in three main areas: smart cards, etched lead frames, and IoT eSIM chip packaging [1][2]. Group 2: Core Technology and Business Model - The smart card business serves as the foundation for Xinhenghui's technological accumulation and business model innovation, utilizing a unique "upstream and downstream collaboration" approach [2]. - Xinhenghui's proprietary technologies, including high-precision metal surface patterning and surface treatment techniques, have enabled it to overcome high barriers to entry in flexible lead frame manufacturing [2][3]. Group 3: Growth and Market Expansion - The company has successfully extended its technology and experience from the smart card sector to the etched lead frame and IoT eSIM chip packaging markets, leveraging shared customers and technical synergies [4]. - Xinhenghui's etched lead frame business has seen a remarkable revenue growth of 46.48% year-on-year, driven by a focus on high-end applications [5]. Group 4: Future Development and Strategy - The company is investing in projects to enhance production capacity and technological innovation, including a 170 million yuan project for high-density QFN/DFN packaging materials [6]. - Xinhenghui aims to become a leading global supplier in the integrated circuit packaging materials sector while also enhancing its position in high-end product markets [6][7].
创新“深”态丨筑牢封装技术壁垒 新恒汇的集成电路自主突破路