Group 1 - Panasonic's MEGTRON9 copper-clad laminate shows significant reduction in circuit loss compared to M8, especially in high-frequency environments, indicating a leap in dielectric performance [1] - The Df value of M9 is lower than that of M8, suggesting that existing PPO/PPE high-frequency resins may not meet the performance requirements of M9, leading to an upgrade in upstream resin materials [1] - M9 copper-clad laminate is expected to utilize more hydrocarbon resins and specialty hydrocarbon resins to meet electrical performance demands [1] Group 2 - Domestic hydrocarbon resin industry is still developing, with companies like Dongcai Technology and Shiming Technology making strides in R&D and production capacity [2] - Dongcai Technology has a planned capacity of 3,500 tons/year for electronic-grade hydrocarbon resin, while Shiming Technology has already established a 500-ton capacity [2] Group 3 - A new type of specialty hydrocarbon resin, anthracene resin, has low Df values (0.0005-0.0006), making it an ideal material for M9 copper-clad laminates [3] - Meilian New Materials' subsidiary, Huihong Technology, is the first in China to produce anthracene monomers for electronic materials, with an annual capacity of 200 tons [3] Group 4 - BCB hydrocarbon resin is facing long-term technological barriers from the US and Japan, but domestic production is underway with a new production line set to launch in November [4] - The new production line by Hubei Disai Hongding High-tech Materials will break the monopoly of US and Japanese companies in high-end electronic chip packaging materials [4] Group 5 - Dongcai Technology is positioned as a leader in the electronic resin sector in China, with significant R&D and production capabilities, and has developed various electronic-grade resins [5][6]
国金证券:松下“马九”覆铜板性能再上台阶 引领电子树脂材料升级换代