Group 1 - The National Integrated Circuit Industry Investment Fund's third phase has initiated its first project by investing up to 450 million RMB in the registered capital of Tuojing Jianke, which is a subsidiary of Tuojing Technology [1][5] - Tuojing Technology plans to raise up to 4.6 billion RMB through a private placement to enhance its main business [3][12] - The investment by Guotou Jixin will account for approximately 12.71% of Tuojing Jianke's registered capital after the capital increase [1][5] Group 2 - Tuojing Jianke focuses on advanced bonding equipment for three-dimensional integration, including hybrid bonding and fusion bonding devices [8] - The company has launched several products, including wafer-to-wafer hybrid bonding equipment and precision measurement devices, which are already being shipped to clients in advanced storage and logic sectors [8][10] - The market for hybrid bonding equipment is expected to grow significantly, with projections indicating a market size increase from 46.1 million USD in 2024 to over 150 million USD by 2027 [10] Group 3 - Tuojing Technology's financial data shows projected revenues of 97.3 million RMB and a net loss of 2.1 million RMB for 2024 [11] - The company aims to use the funds raised from the private placement for the construction of a high-end semiconductor equipment industrialization base and a cutting-edge technology research center [12][13] - The global investment in 300mm wafer fab equipment is expected to grow significantly, with China leading the investment scale [12][14]
大基金三期首个项目来了,涉688072