拟定增不超过46亿，拓荆科技欲募资扩产补流

Group 1 - Company plans to issue A-shares to no more than 35 specific investors, with a maximum of 83.92 million shares and total fundraising not exceeding 4.6 billion yuan, aimed at high-end semiconductor equipment industrialization, advanced technology R&D center construction, and working capital supplementation [1] - Company will increase capital in its subsidiary, with a total financing amount not exceeding 1.04 billion yuan from six participants, including a major investment from Guotou Jixin [1] - After the capital increase, the company's shareholding in its subsidiary will decrease to 53.57%, while Guotou Jixin will become the second-largest shareholder with approximately 12.71% [1] Group 2 - Three-dimensional integration technology is a frontier area in the semiconductor industry, offering significant development potential through vertical stacking of chips to enhance packaging efficiency and reduce power consumption [2] - The subsidiary has launched several products, including wafer-to-wafer hybrid bonding equipment and surface pre-treatment equipment, targeting advanced storage and logic customers [2] - Despite the potential, the subsidiary is still in the early stages of development, with projected revenue of 97.30 million yuan and a net loss of 21.36 million yuan for 2024, and zero revenue in the first quarter of the current year [2]