逸豪新材：HVLP铜箔已进入客户验证阶段

Group 1 - The company has continuously improved its electronic circuit copper foil product matrix, forming a complete product system covering thicknesses from 9μm to 210μm [1] - The company is developing a 12oz ultra-thick copper foil, which will further extend the upper limit of product thickness, while maintaining an industry-leading maximum width of 1,325mm [1] - In the high-frequency and high-speed field, RTF copper foil has been supplied to customers, and HVLP copper foil has entered the customer verification stage [1]