黑芝麻智能再度登陆慕尼黑车展

Core Insights - The 2025 IAA Mobility exhibition in Munich showcased the advancements in smart automotive technology, with Hezhima Intelligent presenting its innovative solutions for AI-driven smart vehicles [2] - Hezhima Intelligent introduced its safety intelligent foundation solution, which utilizes the Wudang C1200 family of cross-domain integration chips to enhance vehicle safety and reduce development costs [2] - The company emphasized the importance of integrating electronic and electrical architectures to facilitate seamless upgrades from entry-level to flagship models [2] Group 1 - Hezhima Intelligent's Wudang C1200 family of chips is central to its safety intelligent foundation solution, providing hardware security isolation and compatibility throughout the product lifecycle [2] - The Wudang C1200 solution aims to significantly lower development costs and shorten development cycles for automotive manufacturers [2] - The company is collaborating with leading global automotive firms to explore the future of smart vehicles powered by AI [2] Group 2 - The Huashan A2000 chip family was highlighted for its high performance and efficiency, integrating multiple functional units for advanced AI applications [3] - The Huashan A2000 platform supports a robust driving assistance technology foundation, ensuring optimal performance and flexibility [3] - Hezhima Intelligent's Wudang C1236 and C1296 chips are recognized for their capabilities in navigation assistance and multi-domain integration, respectively [3] Group 3 - The C1296 cross-domain integration solution has gained market recognition, with plans for mass production in multiple new models from Dongfeng Motor by the end of 2025 [4] - The Huashan A1000 family also showcased a mature software ecosystem, with successful applications in various vehicle models [4] - Hezhima Intelligent's dual-driven model of chips and solutions aims to provide cost-effective and reliable driving assistance technologies for the automotive industry [4]