Core Viewpoint - The company plans to issue convertible bonds to raise up to 1 billion yuan, primarily for acquiring a controlling stake in Ligon Technology and supplementing working capital [1][2]. Group 1: Financing and Acquisition - The total amount to be raised from the convertible bond issuance is capped at 1 billion yuan, which will be used for the acquisition of Ligon Technology and to enhance working capital [1]. - The acquisition involves purchasing a total of 88.79% equity in Guangzhou Ligon Technology Co., Ltd. for a transaction price of 709 million yuan, with an adjustment cap of 133 million yuan [1]. - The funding for the acquisition will come from the company's own funds and external financing, with 700 million yuan from the convertible bond issuance earmarked for the acquisition payment [1]. Group 2: Business and Market Position - Ligon Technology focuses on distributing various IC products, including MCU chips, driver chips, and memory chips, primarily in the industrial IoT and automotive electronics sectors [2]. - The company is an authorized distributor for several well-known chip brands, including NXP, ISSI, 3PEAK, Rockchip, and GigaDevice, with NXP being a core product line [2]. - Post-acquisition, the integration of both companies' distribution capabilities is expected to enhance the product portfolio, improve competitiveness, and meet customer demands for one-stop procurement, thereby increasing market competitiveness and profitability [2].
为收购IC产品分销商立功科技控股权 商络电子拟发行不超10亿元可转债