苏州银行20亿元科创债发行完毕，票面利率1.89%

Group 1 - Suzhou Bank has successfully issued the "Suzhou Bank Co., Ltd. 2025 First Phase Technology Innovation Bond" with a total issuance scale of RMB 2 billion and a fixed interest rate of 1.89% [1] - The bond issuance was completed on September 10, 2025, with payment finalized on September 12, 2025 [1] Group 2 - Since May 2025, the issuance volume of technology innovation bonds has rapidly increased, surpassing RMB 1 trillion, with the banking sector accounting for over RMB 220 billion [3] - Small and medium-sized banks, including city commercial banks and rural commercial banks, have contributed to more than half of the technology innovation bond issuance, becoming significant market participants [3] - Issuing technology innovation bonds provides banks with multiple direct and indirect benefits, including broadening financing channels and offering a new choice beyond traditional financing methods [3] - Technology innovation bonds have a notable interest rate advantage, with issuance costs approximately 5 basis points lower than similar ordinary bonds, leading to potential profit enhancement for banks [3] - Successfully issuing technology innovation bonds signals strong operational stability and good credit quality, enhancing the bank's market position and brand recognition [3]