通富微电：公司光电合封（CPO）领域相关产品已通过初步可靠性测试

Core Viewpoint - Tongfu Microelectronics (002156.SZ) has made significant progress in the development of large-size FCBGA, entering mass production for large-size FCBGA and completing preliminary research for ultra-large size FCBGA, which is now in formal engineering assessment stage [1] Group 1 - The company has achieved important advancements in large-size FCBGA development, with large-size FCBGA entering mass production [1] - The ultra-large size FCBGA has completed preliminary research and is now undergoing formal engineering assessment [1] - The company has addressed product warping and heat dissipation issues for ultra-large size products through optimization of product structure design, material selection, and process improvements [1] Group 2 - The company has made breakthrough progress in the technology development of optical-electrical integrated packaging (CPO), with related products passing initial reliability testing [1]