通富微电：CPO相关产品已通过初步可靠性测试

Group 1 - The company, Tongfu Microelectronics, has made significant breakthroughs in the research and development of Co-Packaged Optics (CPO) technology, with related products passing initial reliability tests [1][3] - CPO technology integrates optical engines and switching chips into a single module, considered a key direction for next-generation high-performance computing and data center interconnects [3] - The company is increasing its investment in optical integration research and development, aiming to capture more market opportunities in the new wave of computing infrastructure construction [3] Group 2 - CPO is recognized as an important technological route for optical integration, enhancing transmission rates and reducing power consumption [3] - Major global manufacturers are accelerating their layout in CPO technology, indicating a competitive landscape [3] - If the company can achieve large-scale production, it is expected to occupy a more significant position in the data center and AI computing industry chain [3]