Hu Xiu·2025-09-17 04:05Group 1 - Silicon carbide (SiC) is a third-generation wide bandgap semiconductor material that significantly outperforms traditional silicon-based devices in high-temperature, high-voltage, and high-frequency applications, making it widely used in electric vehicles, photovoltaic energy storage, and 5G communication [1] - The explosive growth of AI computing power has created a new demand for SiC, which addresses the heat dissipation challenges of high-power chips and supports energy efficiency upgrades in data centers [2][4] - SiC's thermal conductivity reaches 490W/mK, over three times that of silicon, and its thermal expansion coefficient is well-matched with chip materials, enhancing heat dissipation and packaging stability [4] Group 2 - NVIDIA's H100 GPU has a power consumption of 700W, with the next-generation Rubin processor expected to exceed 1000W, highlighting the limitations of traditional silicon intermediates [2] - NVIDIA plans to replace silicon intermediates in its CoWoS packaging with SiC, resulting in a temperature drop from 95°C to 75°C for the H100 chip, reducing cooling costs by 30% and doubling chip lifespan [4] - By 2027, SiC intermediates are expected to meet 10% of high-end GPU demand, as TSMC advances SiC packaging technology [6] Group 3 - The demand for electricity in AI data centers is projected to increase nearly 100-fold, necessitating a shift from traditional 54V power supply architectures to an 800V high-voltage direct current (HVDC) framework [7] - Implementing SiC devices in data centers can reduce copper usage by 45% and save over $100,000 in electricity costs annually for every 10MW data center, significantly improving energy efficiency [7] Group 4 - The silicon carbide supply chain has the highest technical barriers and value concentration in the substrate segment, which accounts for 47% of total device costs [11] - Tianyue Advanced is a leading domestic supplier of SiC substrates, holding over 50% market share in China and 22.8% globally, focusing on automotive-grade and power device sectors [12] - Tianjie Heda, another key player, has a significant market share in 6-inch substrates and is positioned to benefit from the growing demand in the photovoltaic sector [13] Group 5 - Jing Sheng Mechanical and Electrical is a leading domestic semiconductor equipment manufacturer, achieving a dual advantage in equipment manufacturing and material production in the SiC sector [15] - The company has developed core equipment for the entire substrate processing chain, enabling a 30% reduction in substrate processing costs [16] - By 2025, Jing Sheng plans to expand its production capacity significantly, supported by substantial investments from national funds [16]