砥砺前行二十载，恒坤新材IPO注册生效

Core Viewpoint - Hengkun New Materials has successfully registered for an IPO on the Sci-Tech Innovation Board, marking a significant milestone in its transformation from traditional optoelectronic film business to key materials for integrated circuits [1][4]. Transformation Development Process - Established in 2004, Hengkun New Materials initially focused on the R&D, production, and sales of optoelectronic film devices and window lens products [1]. - Since 2014, the company has been planning its business transformation towards key materials in the integrated circuit field [1][3]. Technical Innovation Achievements - Hengkun New Materials has achieved significant milestones in technology innovation and R&D investment, focusing on the development and industrial application of key materials for integrated circuits [3]. - The company has successfully introduced imported photoresist materials and precursor materials, which have been validated by leading 12-inch integrated circuit wafer manufacturers in China since 2017 [3]. - Since 2020, Hengkun has begun selling self-produced photoresist and precursor materials, with sales revenue surpassing 100 million yuan in 2022 [3]. - The company’s products are essential for the production processes of advanced NAND, DRAM memory chips, and logic chips at 90nm technology nodes and below [3]. Market Position and Future Prospects - Hengkun New Materials has achieved domestic substitution of similar foreign products, breaking the foreign monopoly on key materials for 12-inch integrated circuits [4]. - The successful IPO is expected to provide new momentum for the company's development and enhance the self-controllable capabilities of China's integrated circuit industry chain [5].