兆驰股份：公司光通信芯片已启动流片 未来将逐步实现自主供应

Core Viewpoint - The company has established a vertically integrated layout in the optical communication field, focusing on the supply of optical chips through a stepwise approach [1] Group 1: Company Developments - The company plans to leverage its vertical integration advantages to promote the independent supply of optical communication chips [1] - The 2.5G DFB laser chip has begun wafer production, with mass production expected by 2025 [1] - Development work for 10G and 25G DFB laser chips has started, with plans to launch 50G DFB and CW DFB chips by 2026 [1] Group 2: Research and Development - The company is actively engaged in the research and development of silicon photonics and PIC technology [1] - The goal is to create solutions for co-packaged optics (CPO) architecture, providing core support for 800G/1.6T ultra-high-speed interconnections [1]