重磅！华为公布多颗新昇腾芯片

Core Viewpoint - Huawei announced the launch of multiple Ascend series chips and their evolution roadmap at the Huawei Connect 2025 event, highlighting advancements in AI infrastructure and computing power [1][3][5]. Group 1: Chip Development - Huawei introduced the Ascend 950, 960, and 970 series chips, emphasizing their self-developed low-cost HBM and a plan to double computing power annually [3][5]. - The Ascend 950 chip will serve as the foundation for a new type of super node, which is claimed to be the strongest globally, surpassing NVIDIA's upcoming NVL576 system expected in 2027 [5][9]. - The company will also update its Kunpeng processors, including the Kunpeng 950 and 960 series, along with super nodes based on these chips [5]. Group 2: Super Node and Connectivity - The new super node based on the Ascend 950 can form a cluster of over 500,000 cards, while the Ascend 960 can exceed 990,000 cards [7]. - A new interconnection protocol named "Lingqu" was announced, aimed at connecting more computing resources together [7]. - The chips and technologies mentioned are set to be launched between 2026 and 2027, with a focus on building a robust foundation for computing needs in China and globally [9].