华为徐直军时隔六年再谈芯片进展

Core Insights - Huawei has unveiled multiple self-developed chip advancements at the 2025 Global Connectivity Conference, including the launch timeline for the Ascend 950PR chip in Q1 2026, which utilizes Huawei's self-developed HBM technology [2] - The concept of "super nodes" has emerged as a new norm in AI infrastructure, with over 300 Cloud Matrix 384 super nodes deployed, emphasizing the critical role of computing power in the future of artificial intelligence in China [4][5] Group 1 - Huawei's newly released Atlas950 SuperPoD and Atlas 960 SuperPoD super nodes support 8,192 and 15,488 Ascend cards respectively, showcasing global leadership in key metrics such as card scale, total computing power, memory capacity, and interconnect bandwidth [7] - The company has also introduced super node clusters, Atlas950 SuperCluster and Atlas960 SuperCluster, with computing power exceeding 500,000 cards and reaching one million cards [7] - Huawei is confident in providing sustainable and ample computing power for the long-term rapid development of artificial intelligence, leveraging the strongest computing power globally through super nodes and clusters [8] Group 2 - Huawei has pioneered the introduction of super node technology into general computing, launching the world's first general computing super node, TaiShan 950 SuperPoD, which aims to replace various large and small machines as well as Exadata database integrated machines [8] - The company has overcome significant challenges in interconnect technology for large-scale super nodes, introducing the UnifiedBus interconnect protocol, with plans to open the Lingqu 2.0 technical specifications in the future [8] - Despite facing restrictions from U.S. sanctions that limit access to TSMC for chip production, Huawei emphasizes its strengths in connectivity technology, which has been developed over 30 years, enabling the achievement of super nodes with tens of thousands of cards [8]