国机精工：金刚石铜导热系数大约800W/m·K

Group 1 - The company has developed a diamond-copper hybrid heat dissipation product, which shows a significant improvement in thermal conductivity compared to pure copper [2] - The thermal conductivity of diamond-copper is approximately 800 W/m·K, while that of copper is about 400 W/m·K, indicating a 100% increase in efficiency [2] - The company has been questioned about the price increase of pure copper and its impact on the new product's competitiveness [2]