Nvidia(US:NVDA) 智通财经网·2025-09-18 09:16Core Insights - NVIDIA is actively pushing for higher specifications from suppliers of key components for the Vera Rubin server rack, particularly aiming to increase the HBM4 Speed per Pin to 10Gbps in response to AMD's upcoming MI450 Helios platform launch in 2026 [1][2] - HBM4 is identified as a critical component for AI servers, with its transmission speed and bandwidth being focal points for specification improvements [1] - Samsung plans to upgrade its HBM4 base die process node to FinFET 4nm by 2024, with mass production expected by the end of this year, aiming for a transmission speed of 10Gbps, which is anticipated to surpass competitors SK hynix and Micron in output proportion [1] Supplier Dynamics - NVIDIA's consideration of HBM4 specifications will also depend on supply capacity; if supply is insufficient or if new specifications excessively increase energy consumption or costs, NVIDIA may abandon the upgrade or categorize platform products based on different component levels [2] - After the initial supplier certification, NVIDIA may allow other companies more time to adjust for the second phase of certification, which could impact the ramp-up speed of production for the Vera Rubin platform [2] - TrendForce forecasts that SK hynix will remain the largest supplier of HBM4 in 2026, based on existing partnerships and the maturity, reliability, and scale of production capacity, while Samsung and Micron's supply shares will depend on the performance of subsequent product samples [2]