Core Viewpoint - Glass is gaining attention as the next-generation packaging substrate material due to its numerous advantages over organic substrates, including lower thermal expansion, improved flatness, and reduced transmission loss for high-frequency applications [1][2][3]. Group 1: Advantages of Glass Substrates - Glass substrates are significantly flatter and have a lower thermal expansion coefficient compared to organic substrates, simplifying lithography processes [2]. - The warpage issues associated with multi-chip packaging have been notably improved with glass substrates, allowing for better chip bonding and alignment [2]. - Glass substrates provide extremely low transmission loss for high-frequency devices, making them suitable for applications like 6G communications [3][4]. Group 2: Manufacturing Challenges - The cutting of glass substrates can lead to micro-cracks, which pose a significant manufacturing challenge [3][17]. - The process of creating through-glass vias (TGV) is complex, with challenges in achieving high yield rates due to the need for precise laser etching and filling techniques [6][12]. - Despite the challenges, companies like Intel continue to invest heavily in glass substrate technology, indicating a strong belief in its potential for high-performance computing and AI applications [3][12]. Group 3: Innovations in Glass Processing - Recent advancements in laser-induced deep etching (LIDE) technology have improved the manufacturing process for TGVs, allowing for smaller and more precise vias [6][10]. - The use of automated systems for wet etching processes has been developed to enhance the efficiency and yield of glass substrate production [7][10]. - New methods, such as embedding cut glass substrates in organic resin for edge protection, are being explored to mitigate issues related to cracking during processing [19][20]. Group 4: Future Outlook - The glass ecosystem is preparing for the ongoing growth in chip and substrate sizes for advanced multi-chip packaging, with significant progress being made in the industry [22]. - The potential for direct laser etching using excimer lasers is being considered as a more environmentally friendly alternative to traditional methods, provided it can meet the requirements for subsequent copper filling [22]. - Continued research into polymer retraction techniques before cutting may help prevent micro-cracking, indicating a focus on improving manufacturing processes for glass substrates [22].
玻璃基板,势头强劲
Sou Hu Cai Jing·2025-09-19 05:14