岱勒新材(300700.SZ)：公司的金刚石线产品可用于第三代半导体切割

Core Viewpoint - The company Dai Le New Materials (300700.SZ) has announced that its diamond wire products can be utilized for cutting third-generation semiconductors [1] Group 1 - The company is actively engaging with investors through an interactive platform [1] - The application of diamond wire products in the semiconductor industry highlights the company's innovative capabilities [1]