立中集团：公司研发的硅铝合金、铝碳化硅等新材料能够用于半导体设备零部件的制造

Core Viewpoint - The company, Lichung Group, has developed new materials such as silicon-aluminum alloy and aluminum carbide silicon for manufacturing semiconductor equipment components, indicating a focus on high-precision and high-performance applications in the semiconductor industry [1] Group 1 - The silicon-aluminum alloy is primarily used for manufacturing ultra-high precision components in semiconductor equipment, particularly for high-speed moving parts [1] - The aluminum carbide silicon is mainly utilized for components that require high stiffness and wear resistance [1] - Detailed information regarding these materials is currently undisclosed due to company confidentiality requirements [1]